Bipolar junction transistors with double-tapered emitter fingers

ABSTRACT

Device structures for a bipolar junction transistor and methods of fabricating a device structure for a bipolar junction transistor. A base layer comprised of a first semiconductor material is formed. An emitter layer comprised of a second semiconductor material is formed on the base layer. The emitter layer is patterned to form an emitter finger having a length and a width that changes along the length of the emitter finger.

BACKGROUND

The invention relates generally to semiconductor devices and integratedcircuit fabrication and, in particular, to fabrication methods anddevice structures for a bipolar junction transistor.

Bipolar junction transistors may be found, among other end uses, inhigh-frequency and high-power applications. In particular, bipolarjunction transistors may find specific end uses in amplifiers forwireless communications systems and mobile devices, switches, andoscillators. Bipolar junction transistors may also be used in high-speedlogic circuits. Bipolar junction transistors are three-terminalelectronic devices that include an emitter, an intrinsic base, and acollector defined by regions of different semiconductor materials. Inthe device structure, the intrinsic base is situated between the emitterand collector. An NPN bipolar junction transistor may include n-typesemiconductor material regions constituting the emitter and collector,and a region of p-type semiconductor material constituting the intrinsicbase. A PNP bipolar junction transistor includes p-type semiconductormaterial regions constituting the emitter and collector, and a region ofn-type semiconductor material constituting the intrinsic base. Inoperation, the base-emitter junction is forward biased, thebase-collector junction is reverse biased, and the collector-emittercurrent may be controlled by the base-emitter voltage.

Bipolar junction transistors are composed of one or more emitter fingersand they may have a non-uniform temperature profile along their fingerlength with a cooler temperature profile at the ends of the fingers.This non-uniform temperature may change transistor parameters, such ascurrent gain (beta), resulting in non-uniform beta along the length ofthe finger. Thus, it is desirable to make the temperature profile alongand among the emitter fingers more uniform.

Consequently, improved fabrication methods and device structures areneeded for a bipolar junction transistor.

SUMMARY

In an embodiment of the invention, a method is provided for fabricatinga device structure for a bipolar junction transistor. A base layercomprised of a first semiconductor material is formed. An emitter layercomprised of a second semiconductor material is formed on the baselayer. The emitter layer is patterned to form an emitter finger having alength and a width that changes along the length of the emitter finger.

In an embodiment of the invention, a device structure is provided for abipolar junction transistor. The device structure includes a base layercomprised of a first semiconductor material and an emitter fingercomprised of a second semiconductor material on the base layer. Theemitter finger has a length and a width that changes along the length ofthe emitter finger.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate various embodiments of theinvention and, together with a general description of the inventiongiven above and the detailed description of the embodiments given below,serve to explain the embodiments of the invention.

FIG. 1 is a top view of a portion of a substrate processed by aprocessing method for fabricating a device structure in accordance withan embodiment of the invention.

FIG. 1A is an enlarged view of the one of the emitter fingers shown inFIG. 1.

FIG. 1B is a cross-sectional view taken generally along line 1B-1B inFIG. 1.

FIGS. 2-4 are top views similar to FIG. 1 of a substrate portionprocessed by processing methods for fabricating a device structure inaccordance with alternative embodiments of the invention.

FIG. 5 is a top view similar to FIG. 1A of an emitter finger inaccordance with an alternative embodiment of the invention.

DETAILED DESCRIPTION

With reference to FIGS. 1, 1A, 1B and in accordance with an embodimentof the invention, a device structure 10 is formed using a substrate 11comprises a single-crystal semiconductor material usable to form thedevices of an integrated circuit. For simplicity, the device structure10 does not show some details associated with a typical SiGe HBT orother NPN transistor types. The semiconductor material constituting thesubstrate 11 may include an epitaxial layer at its top surface 17, whichmay contain an amount of an electrically-active dopant that enhances itselectrical properties relative to the remainder of the substrate 11. Forexample, the substrate 11 may include an epitaxial layer of singlecrystal silicon that is doped with a concentration of, in a constructionfor an NPN transistor, an n-type dopant from Group V of the PeriodicTable (e.g., phosphorus (P), arsenic (As), or antimony (Sb)) in aconcentration effective to impart n-type conductivity.

Shallow trench isolation regions 12 are located in the semiconductormaterial of the substrate 11. The shallow trench isolation regions 12define the bounds of, and furnish electrical isolation for, each emitterfinger relative to the adjacent ones through the collector 14. Incertain embodiments, the trench isolation regions 12 may be omitted frominternal emitter finger regions to improve thermal dissipation.

Deep trench isolation regions 13 are located in the semiconductormaterial of the substrate 11. The deep trench isolation regions 13define the bounds of, and furnish electrical isolation for, thecollector 14 and collector contact regions 16, 18, which are eachcomprised of the semiconductor material of the substrate 11 to theadjacent devices. The collector contact regions 16, 18 are positionedadjacent to the collector 14, and are laterally separated from thecollector 14 by the shallow trench isolation regions 12. The collectorcontact regions 16, 18 are coupled with the collector 14 by portions ofthe semiconductor material of the substrate 11 positioned beneath theshallow trench isolation regions 12. Typically, the deep trenchisolation regions 13 are 3 um to 6 um deep relative to the top surface17 of the substrate 11 and are filled with one or more dielectricmaterials. In certain embodiments, the deep trench isolation regions 13may be omitted from the collector boundary regions and replaced withshallow trench isolation regions 12 for better thermal dissipation.

The shallow trench isolation regions 12 may be formed by depositing ahardmask, patterning the hardmask and substrate 11 with lithography andetching processes to define trenches, depositing an electrical insulatorto fill the trenches, planarizing the electrical insulator relative tothe hardmask using a chemical mechanical polishing (CMP) process, andremoving the hardmask. In one embodiment, the shallow trench isolationregions 12 may be comprised of silicon dioxide (SiO₂) deposited bychemical vapor phase deposition (CVD).

The deep trench isolation regions 13 may be formed by depositing ahardmask, patterning with lithography and etching processes to definetrenches through the shallow trench region 12 and substrate 11,depositing an electrical insulator to fill the trenches, planarizingusing a chemical mechanical polishing (CMP) process, and removing thehardmask. In one embodiment, the deep trench isolation regions 13 may becomprised of silicon dioxide (SiO₂) deposited by chemical vapor phasedeposition (CVD).

A base layer 20 is located on the top surface 17 of the substrate 11.The base layer 20 may be comprised of a semiconductor material, such assilicon-germanium (SiGe) in an alloy with a content of silicon (Si)ranging from 95 atomic percent to 50 atomic percent and a content ofgermanium (Ge) ranging from 5 atomic percent to 50 atomic percent. Thegermanium content of the base layer 20 may be uniform across thethickness of base layer 20, or graded and/or stepped across thethickness of base layer 20. If the germanium content is stepped,respective thicknesses of the base layer 20 that are directly adjacentto the substrate 11 and directly adjacent to the subsequently-formedemitter fingers may lack a germanium content and may thereforeconstitute intrinsic layers comprised entirely of silicon. The baselayer 20 may comprise a dopant, such as a p-type dopant selected fromGroup III of the Periodic Table (e.g., boron) in a concentration that iseffective to impart p-type conductivity to the constituent semiconductormaterial and, optionally, carbon (C) to suppress the mobility of thep-type dopant.

The base layer 20 may be formed using a low temperature epitaxial (LTE)growth process, such as vapor phase epitaxy (VPE) conducted at a growthtemperature ranging from 400° C. to 850° C. Single crystal semiconductormaterial (e.g., single crystal silicon and/or single crystal SiGe) isepitaxially grown or deposited by the low temperature epitaxial growthprocess on the top surface 17 of substrate 11. The base layer 20 mayhave an epitaxial relationship with the single crystal semiconductormaterial of the substrate 11 in which the crystal structure andorientation of the substrate 11 operates as a template to establish thecrystal structure and orientation of the base layer 20 during growth.

An emitter of the device structure 10 is collectively comprised of aplurality of emitter fingers 22, 24, 26, 28 that are located on the topsurface of the base layer 20. The emitter fingers 22, 24, 26, 28 arearranged lengthwise parallel to each other with emitter fingers 24, 26centrally located between emitter fingers 22 and emitter finger 28 atthe periphery of a cell. The cell including the emitter fingers 22, 24,26, 28 may include a different number of emitter fingers than the numberin the representative embodiment for the device structure 10.

The emitter fingers 22, 24, 26, 28 may be comprised of a semiconductormaterial that differs in composition from the semiconductor material ofthe base layer 20 and that has an opposite conductivity type from thesemiconductor material of the base layer 20. For example, thecomposition of the material comprising the emitter fingers 22, 24, 26,28 may be comprised of silicon and lack germanium that is present in atleast a portion of the base layer 20, and may contain an n-type dopantin a concentration effective to impart n-type conductivity. In arepresentative embodiment, the semiconductor material comprising theemitter fingers 22, 24, 26, 28 may be n-type polysilicon (i.e., n-typepolycrystalline silicon) deposited by chemical vapor deposition.

To form the emitter fingers 22, 24, 26, 28, a mask layer may be appliedon a top surface of a deposited layer (e.g., n-type polysilicon) andpatterned with photolithography. Specifically, a mask layer is appliedthat covers the deposited layer at the intended location of the emitterfingers 22, 24, 26, 28 to be subsequently formed. To that end, the masklayer may comprise a light-sensitive material, such as a photoresist,that is applied as a coating by a spin coating process, pre-baked,exposed to light projected through a photomask, baked after exposure,and developed with a chemical developer to pattern an etch mask. Theshape of the strips is selected to match and produce the desireddouble-tapered shape for the emitter fingers 22, 24, 26, 28. An etchingprocess is used, with the mask layer present on the top surface of thedeposited layer, to form the emitter fingers 22, 24, 26, 28 from thedeposited layer at the locations of the stripes in the pattern. Theetching process may be conducted in a single etching step or multiplesteps, and may rely on one or more etch chemistries. The mask layer maybe removed after the emitter fingers 22, 24, 26, 28 are formed by theetching process. If comprised of a photoresist, the mask layer may beremoved by ashing or solvent stripping, followed by a conventionalcleaning process.

The portions of the base layer 20 covered by the emitter fingers 22, 24,26, 28 may define an intrinsic base that forms a junction with theemitter, and that forms another junction with the collector 14. Portionsof the base layer 20 that are not covered by the emitter fingers 22, 24,26, 28 may be doped (e.g., by ion implantation) to define an extrinsicbase with enhanced electrical conductivity in comparison with theintrinsic base. Spacers 30 may be formed on the vertical sidewalls ofthe emitter fingers 22, 24, 26, 28 by etching one or more dielectriclayers (e.g., silicon dioxide or silicon nitride (Si₃N₄)) with ananisotropic etching process.

The resulting device structure 10 is a bipolar junction transistor thatincludes the emitter fingers 22, 24, 26, 28, the collector 14, and theportion of the base layer 20 (i.e., intrinsic base) that is verticallybetween the emitter fingers 22, 24, 26, 28 and the collector 14. Thedevice structure 10 may be characterized as a heterojunction bipolartransistor (HBT) if two or all three of the semiconductor materialscomprising the emitter fingers 22, 24, 26, 28, the collector 14, and thebase layer 20 have different compositions. During the front-end-of-line(FEOL) portion of the fabrication process, the device structure 10 isreplicated across at least a portion of the surface area of thesubstrate 11. In BiCMOS integrated circuits, complementarymetal-oxide-semiconductor (CMOS) transistors may be formed using otherregions of the substrate 11, and may be protected while bipolar junctiontransistors are formed. As a result, bipolar junction transistors (orHBTs) and CMOS transistors may be available and co-located on the samesubstrate 11.

Standard middle-of-line (MOL) processing and back-end-of-line (BEOL)processing follows, which includes formation of dielectric layers, viaplugs, and wiring for an interconnect structure coupled with the devicestructure 10, as well as other similar contacts for additional devicestructures 10 and CMOS transistors that may be included in othercircuitry fabricated on the substrate 11. The MOL processing, whichincludes formation of one or more dielectrics layer, rows of contacts34-38 coupled with the base layer 20, and contacts coupled with thecollector contact regions 16, 18, follows to define a local interconnectstructure. Wiring formed by MOL and BEOL processing may couple theemitter fingers 22, 24, 26, 28 in parallel with other circuitry on thechip or off the chip.

The row of contacts 34 is located between collector contact region 16and emitter finger 22, and the row of contacts 38 is located betweencollector contact region 18 and emitter finger 28. The row of contacts35 is located between emitter finger 22 and emitter finger 24, the rowof contacts 36 is located between emitter finger 24 and emitter finger26, and the row of contacts 37 is located between emitter finger 26 andemitter finger 28.

The emitter fingers 22, 24, 26, 28 have geometrical shapes parameterizedto improve the uniformity of the temperature distribution across theemitter. In particular, the emitter fingers 22, 24, 26, 28 are eachtapered along their respective lengths L such that the widths (i.e., thedistances between the opposite sidewalls in a direction transverse tothe lengths L) of the emitter fingers 22, 24, 26, 28 vary with positionalong the length. The dimensions of the emitter fingers 22, 24, 26, 28may be evaluated in a plane that is parallel to the top surface 17 ofthe substrate 11 and that is transverse to the layer thickness of theemitter fingers 22, 24, 26, 28.

As best shown in FIG. 1A, the representative emitter finger 22 includesend surfaces 22 a, 22 b at its opposite ends and side surfaces 41 thatconnect the end surfaces 22 a, 22 b. The end surface 22 a is spacedalong the length L from the end surface 22 b. The emitter finger 22 maybe symmetrical along its length L relative to the midplane MP. The widthof the emitter finger 22 (i.e., the distance between the side surfaces41 at any point along the length L) is greatest at its opposite endsurfaces 22 a, 22 b (i.e., W1) and is smallest at the midplane MP (i.e.,W1−Δ where Δ represents the width difference). The width of emitterfinger 22 tapers (i.e., narrows) at an angle α from the width W1 at theend surface 22 a of emitter finger 22 to the width W1−Δ at midplane MPof emitter finger 22. The width of emitter finger 22 also tapers at anangle α from the width W1 at the end surface 22 b of emitter finger 22to the width W1−Δ at the midplane MP of emitter finger 22. In anembodiment, the width of the emitter finger 22 decreases linearly fromeach of the opposite end surfaces 22 a, 22 b toward the midplane MP. Asthe emitter finger 22 tapers toward midplane MP, the distance separatingthe side surfaces 41 decreases and is at a minimum at the midplane MP.The angle α is related to the value of width difference Δ. As the widthdifference Δ increases, the degree of tapering and the angle α likewiseincrease as the dual tapered geometrical shape of the emitter fingers22, 24, 26, 28 becomes more pronounced.

In an alternative embodiment, the width of the emitter finger 22 maydecrease non-linearly from each of the opposite end surfaces 22 a, 22 btoward the midplane MP.

Emitter fingers 24, 26, 28 are constructed similar to the representativeemitter finger 22 in that each includes end surfaces and side surfacesanalogous to end surfaces 22 a, b and side surfaces 41. In anembodiment, emitter finger 28 may have the same construction as emitterfinger 22. In an embodiment, emitter fingers 24, 26 may likewise besimilar in construction to emitter finger 22 other than the widths W2may differ from the widths W1 of emitter fingers 22, 28. In addition,the angle α may be different for emitter fingers 24, 26 in comparisonwith emitter fingers 22, 28.

In the representative embodiment, the emitter fingers 22, 24, 26, 28 mayhave the same dimensions in that the individual widths W1 of emitterfingers 22, 28 are equal to the individual widths W2 of emitter fingers24, 26. In an embodiment, the width of the emitter fingers 22, 24, 26,28 at each opposite end is twice the width at midplane MP. Theindividual widths W1 vary along the lengths, L, such that each of theemitter fingers 22, 28 is wider by a factor of two at the respectiveopposite end surfaces 22 a, b, 28 a, b than at the midplane MP. Theindividual widths W2 vary along the lengths, L, such that each of theemitter fingers 24, 26 is wider by a factor of two at the respectiveopposite end surfaces 24 a, b, 26 a, b than at the midplane MP.

The value for the width difference Δ may range from 0.1 μm to 1.0 μm. Asa specific numerical example, each of the emitter fingers 22, 24, 26, 28may have a width of 1.6 μm at their respective opposite ends and a widthof 0.8 μm at the midplane MP so that the average width is 1.2 μm. If theemitter fingers 22, 24, 26, 28 have the same dimensions and the valuesfor the widths W1 and W2 are equal, the values for Δ and a will also beequal. The width difference Δ for the preceding numerical example isequal to 0.8 μm. Alternatively, even if the widths W1 and W2 are notequal, the values for Δ and α may be equal.

Emitter finger 22 is separated from emitter finger 24 by a spacing, S1,emitter finger 24 is separated from emitter finger 26 by a spacing, S2,and emitter finger 26 is separated from emitter finger 28 by a spacing,S3. In the representative embodiment, the spacings S1, S2, and S3 areevaluated at the opposite ends of the emitter fingers 22, 24, 26, 28.Alternatively, the spacings S1, S2, and S3 may be evaluated at anotherlocation (e.g., at the midplane MP) between opposite ends of the emitterfingers 22, 24, 26, 28. In the representative embodiment, the emitterfingers 22, 24, 26, 28 have the same spacing in that individual spacingsS1, S2, and S3 are equal to provide a uniform pitch.

During operation, the emitter fingers 22, 24, 26, 28 experience atemperature rise arising from power dissipation and Joule heating. Thedouble-tapered emitter fingers 22, 24, 26, 28 may exhibit improvedtemperature uniformity along their lengths L relative to each other suchthat the variation in the temperature profiles among the emitter fingers22, 24, 26, 28 is reduced in comparison with non-tapered emitter fingersof uniform width and spacing. In addition, double-tapered emitterfingers 22, 24, 26, 28 may exhibit reduced peak temperatures incomparison with non-tapered emitter fingers of uniform width and spacingthat may exhibit a non-uniform temperature profile along their fingerlength with a cooler temperature profile at the ends of the fingers. Asa result, the temperature profiles for the emitter fingers 22, 24, 26,28 may exhibit a higher level of similarity than in the absence of thedouble-tapered shape and a reduced non-uniformity in their current gainor beta along their length.

The improved temperature uniformity and reduced peak temperatures of thedouble-tapered emitter fingers 22, 24, 26, 28 may reduce the probabilityof thermal runaway arising from a temperature increase that prompts acurrent increase, which may lead to a further increase in temperature(i.e., an uncontrolled positive feedback). Reducing the susceptibilityto thermal runaway and the peak temperature may improve the lifetime androbustness of a cell of a power amplifier in which the emitter fingers22, 24, 26, 28 are coupled in parallel. This may enhance thermalstability and power handling capability over the lifetime of the poweramplifier. The parameterization of the double-tapering of the emitterfingers 22, 24, 26, 28 may be selected such that the total footprintprojected as a layout area onto the surface of the base layer 20 matchesthe layout area of non-tapered emitter fingers of uniform width in thecontext of a design modification to an existing device structure. Inaddition, ballasting resistors may not be required to promotetemperature uniformity among the different emitter fingers 22, 24, 26,28, although they can be used to further improve the thermal behavior ofthe device.

With reference to FIG. 2 in which like reference numerals refer to likefeatures in FIGS. 1, 1A, 1B, the tapering and the spacing of the emitterfingers 22, 24, 26, 28 in the cell may be adjusted to change thetemperature profiles. In particular, the emitter fingers 22, 28 at theperiphery of the cell may be configured with the one set of dimensionsto provide the double tapering for emitter fingers 22, 28, and emitterfingers 24, 26 may be configured with a different set of dimensions toprovide the double tapering for emitter fingers 24, 26. Emitter fingers24, 26 are centrally located in the cell between emitter finger 22 andemitter finger 28. In the representative embodiment, the width W1 ofemitter fingers 22, 28 that are at the periphery of the cell is greaterthan the width W2 of emitter fingers 24, 26. The individual widths W1and W2 still vary along the lengths, L, such that each of the emitterfingers 22, 24, 26, 28 is wider by a factor of two at the respectiveopposite end surfaces 22 a, b, 24 a, b, 26 a, b, 28 a, b than at themidplane. However, the width W2 may be a fixed value less than (i.e.,narrower than) the width W1 at any given location along the commonlengths. As a numerical example, the widths W1 at end surfaces 22 a, b,28 a, b may be 1.6 μm and the widths W2 at end surfaces 24 a, b, 26 a, bmay be 1.2 μm to provide a 0.4 μm width difference, and the widths W1 atmidplane of emitter fingers 22, 28 may be 1.2 μm and the widths W2 ofemitter fingers 24, 26 may be 0.8 μm to also provide a 0.4 μm widthdifference. At any given location along the lengths L between theopposite ends, the width difference (i.e., Δ) is constant (i.e., 0.4 μm)to provide the fixed value.

The spacings S1, S2, and S3 of the emitter fingers 22, 24, 26, 28 mayalso be adjusted to provide a non-uniform spacing or pitch.Specifically, the spacing S2 between emitter fingers 24, 26 may begreater than the spacing S1 between emitter fingers 22, 24 and greaterthan the spacing S3 between emitter fingers 26, 28, and the spacings S1and S3 may be equal. In other words, the emitter fingers 24, 26 that arecentrally located in the cell may have a greater spacing S2 than thespacings S1, S3 between emitter fingers 22, 24 and emitter fingers 26,28 at the periphery of the cell. In an embodiment, the spacing S2 may beequal to twice the spacing S1 and equal to twice the spacing S3. Theincrease in the spacing S2 may promote the addition of an additional rowof contacts 39 between emitter fingers 24, 26 such that multiple rows ofcontacts 36, 39 contact the base layer 20 between emitter fingers 24,26.

The smaller width of the emitter fingers 24, 26 in comparison withemitter fingers 22, 28 and/or the wider spacing of the emitter fingers24, 26 in comparison with emitter fingers 22, 24 and emitter fingers 26,28 may further improve the temperature uniformity along their lengths Lrelative to each other such that the variation in the temperatureprofiles among the emitter fingers 22, 24, 26, 28 is reduced incomparison with non-tapered emitter fingers of uniform width andspacing.

With reference to FIG. 3 in which like reference numerals refer to likefeatures in FIGS. 1, 1A, 1B, a device structure 50 may be comprised of aplurality of unit cells 52, 54, 56 in which one or more of theindividual unit cells 52, 54, 56 is constructed with the devicestructure 10 of FIGS. 1, 1A, 1B and includes a plurality of emitterfingers with the double-tapered widths and spacing characterizing theemitter fingers 22, 24, 26, 28. In the representative embodiment, all ofthe individual unit cells 52, 54, 56 are constructed with the devicestructure of FIGS. 1, 1A, 1B. Additional collector contacts 46, 48 arerespectively located between unit cells 52 and 54 and between unit cells54 and 56. The emitter fingers in all of the unit cells 52, 54, 56 arecoupled in parallel in the device structure 50. In an embodiment, thedevice structure 50 may be utilized in the construction of a poweramplifier.

With reference to FIG. 4 in which like reference numerals refer to likefeatures in FIG. 2, a device structure 60 may be comprised of aplurality of unit cells 62, 64, 66 in which one or more of theindividual unit cells 62, 64, 66 is constructed with the devicestructure 10 of FIG. 2 and includes a plurality of emitter fingers withthe double-tapered widths and spacing characterizing the emitter fingers22, 24, 26, 28. In the representative embodiment, all of the individualunit cells 62, 64, 66 are constructed with the device structure of FIGS.2, 2A, 2B. The emitter fingers in all of the unit cells 62, 64, 66 arecoupled in parallel in the device structure 60. In an embodiment, thedevice structure 60 may be utilized in the construction of a poweramplifier.

In some specific embodiments, the unit cells 52, 54, 56 of the powercell array in FIG. 3 and the unit cells 62, 64, 66 of the power cellarray in FIG. 4 may be identical in terms of spacings and widths for theemitter fingers 22, 24, 26, 28 in each unit cell. However, the unitcells may be stitched together for optimized temperature profile as thewidths and spacings within each particular unit cell may differ from thewidths and spacings in the other unit cells. Furthermore, the intra-cellspacings between adjacent pairs of unit cells 52, 54, 56 or betweenadjacent pairs of unit cells 62, 64, 66 may differ. As a specificexample, the central unit cell (e.g., unit cell 54 or unit cell 64) mayhave larger spacings relative to the emitter fingers in the peripheralunit cells (e.g., unit cells 52, 56 or unit cells 62, 66).

In certain embodiments, some or all of the emitter fingers 22, 24, 26,28 in one or more of the unit cells 52, 54, 56 or some or all of theemitter fingers 22, 24, 26, 28 in one or more of the unit cells 62, 64,66 may be rectangular and not double-tapered.

With reference to FIG. 5 in which like reference numerals refer to likefeatures in FIG. 1A, the emitter fingers 22, 24, 26, 28 may beconstructed from a plurality of blocks or steps 70 of semiconductormaterial. In the representative emitter finger 22, the steps 70progressively change in dimensions (i.e., become smaller in size) alongthe length L from each of the opposite end surfaces 22 a, 22 b towardthe midplane MP. The side surfaces 41 of the emitter finger 22 arestepwise continuous and no longer does the width W1 decrease in acontinuous manner from the end surfaces 22 a, 22 b to the midplane MP.The side surfaces 41 of the emitter finger 22 include a plurality ofdiscrete vertical planar surfaces that incrementally decrease in sizeand, in particular, incrementally decrease in width to provide thedouble tapering characterized by the width difference Δ and the angle α.Emitter fingers 24, 26, 28 may have the same type of construction asemitter finger 22 consistent with the description of the emitter fingers22, 24, 26, 28 in connection with FIGS. 1-4.

The emitter fingers 22, 24, 26, 28 in the alternative embodiment areformed using a mask layer that is applied on a top surface of adeposited layer (e.g., n-type polysilicon) and patterned withphotolithography. The use of steps 70 during patterning may be employed,for example, in integrated circuit processes that do not allow eithernon-orthogonal or diagonal lines. The number of discrete steps 70contained in the progression from largest size to smallest size may varycontingent upon factors such as the design rules for the emitterdefinition layer and the taper and width dimension in the designspecification for the device structure 10.

The methods as described above are used in the fabrication of integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (e.g., as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case, the chip is mounted in a single chip package (e.g., aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (e.g., a ceramic carrierthat has either or both surface interconnections or buriedinterconnections). In any case, the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

A feature may be “connected” or “coupled” to or with another element maybe directly connected or coupled to the other element or, instead, oneor more intervening elements may be present. A feature may be “directlyconnected” or “directly coupled” to another element if interveningelements are absent. A feature may be “indirectly connected” or“indirectly coupled” to another element if at least one interveningelement is present.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

1. A method of fabricating a device structure for a bipolar junctiontransistor, the method comprising: forming a base layer comprised of afirst semiconductor material; forming an emitter layer comprised of asecond semiconductor material on the base layer; and patterning theemitter layer to form a first emitter finger having a length and a widththat changes along the length of the first emitter finger.
 2. The methodof claim 1 wherein the first emitter finger has a first end surface anda second end surface spaced along the length from the first end surface,and the width of the first emitter finger at the first end surface isgreater than the width of the first emitter finger at a first positionalong the length between the first end surface and the second endsurface.
 3. The method of claim 2 wherein the first emitter fingertapers from the first end surface toward a midplane of the first emitterfinger.
 4. The method of claim 2 wherein the width of the first emitterfinger at the second end surface is greater than the width of the firstemitter finger at a position along the length of the first emitterfinger.
 5. The method of claim 4 wherein the first emitter finger tapersfrom the first end surface toward a midplane of the first emitterfinger, and the first emitter finger tapers from the second end surfacetoward the midplane of the first emitter finger
 6. The method of claim 1wherein the emitter layer is patterned to form a second emitter fingerhaving a length and a width that changes along the length of the secondemitter finger.
 7. The method of claim 6 wherein the width of the secondemitter finger is different from the width of the first emitter finger.8. The method of claim 6 wherein the emitter layer is patterned to forma third emitter finger having a length and a width that changes alongthe length of the third emitter finger, the first emitter finger isseparated by a first spacing from the second emitter finger, the secondemitter finger is separated by a second spacing from the third emitterfinger, and the first spacing is not equal to the second spacing.
 9. Themethod of claim 8 wherein the second emitter finger is located laterallybetween the first emitter finger and the third emitter finger.
 10. Themethod of claim 1 wherein patterning the emitter layer to form the firstemitter finger comprises: forming the emitter finger from a plurality ofblocks that vary in dimensions, wherein the first emitter finger has afirst end surface and a second end surface spaced along the length fromthe first end surface, and the dimensions of the blocks proximate to thefirst end surface and proximate to the second end surface are greaterthan the dimensions of the blocks at other positions along the length.11. A device structure for a bipolar junction transistor, the devicestructure comprising: a base layer comprised of a first semiconductormaterial; and a first emitter finger comprised of a second semiconductormaterial on the base layer, the first emitter finger having a length anda width that changes along the length of the first emitter finger. 12.The device structure of claim 11 wherein the first emitter finger has afirst end surface and a second end surface spaced along the length fromthe first end surface, and the width of the first emitter finger at thefirst end surface is greater than the width of the first emitter fingerat a first position along the length between the first end surface andthe second end surface.
 13. The device structure of claim 12 wherein thefirst emitter finger tapers from the first end surface toward a midplaneof the first emitter finger.
 14. The device structure of claim 12wherein the width of the first emitter finger at the second end surfaceis greater than the width of the first emitter finger at a positionalong the length of the first emitter finger.
 15. The device structureof claim 14 wherein the first emitter finger tapers from the first endsurface toward a midplane of the first emitter finger, and the secondemitter finger tapers from the second end surface toward the midplane ofthe first emitter finger
 16. The device structure of claim 11 furthercomprising: a second emitter finger comprised of the secondsemiconductor material, the second emitter finger having a length and awidth that changes along the length of the second emitter finger. 17.The device structure of claim 16 wherein the width of the second emitterfinger is different from the width of the first emitter finger.
 18. Thedevice structure of claim 17 further comprising: a third emitter fingercomprised of the second semiconductor material, the third emitter fingerhaving a length and a width that changes along the length of the thirdemitter finger, the first emitter finger separated by a first spacingfrom the second emitter finger, the second emitter finger separated by asecond spacing from the third emitter finger, and the first spacing notequal to the second spacing.
 19. The device structure of claim 18wherein the second emitter finger is located laterally between the firstemitter finger and the third emitter finger.
 20. The device structure ofclaim 16 further comprising: a collector contact region in thesubstrate, wherein the first emitter finger is located laterally betweenthe second emitter finger and the collector contact region.